MULTICOMP MC33264 Heat Sink, Square, PCB, Extruded, TO-220, 10.4 °C/W, 38.1 mm, 34.9 mm, 12.85 mm Hoya B-82CIRPL-W Thickness: 23 mil

Name: MULTICOMP MC33264 Heat Sink, Square, PCB, Extruded, TO-220, 10.4 °C/W, 38.1 mm, 34.9 mm, 12.85 mm Hoya B-82CIRPL-W Thickness: 23 mil
Brand: panoramapapers.com
SKU: 57572069106
Price: 277.27 USD
Availability: InStock
Rating: 4.1629000000000005 (10 reviews)

USD277.27 USD313.27

4.2 SKU 57572069106 panoramapapers.com

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Description

MULTICOMP MC33264 Heat Sink, Square, PCB, Extruded, TO 220, 10.4 °C W, 38.1 mm, 34.9 mm, 12.85 mm Hoya B 82CIRPL W Thickness: 23 mil Thickness: 23 mil Brand WELWYN Part Number RC55Y 1K21BI Quantity Each Technical Data Sheet EN

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MULTICOMP MC33264 Heat Sink, Square, PCB, Extruded, TO-220, 10.4 °C/W, 38.1 mm, 34.9 mm, 12.85 mm Hoya B-82CIRPL-W Thickness: 23 mil

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MULTICOMP MC33264 Heat Sink, Square, PCB, Extruded, TO-220, 10.4 °C/W, 38.1 mm, 34.9 mm, 12.85 mm Hoya B-82CIRPL-W Thickness: 23 mil

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